Free one-stop multi-machine sample testing service, 24-hour report

Eight rubber suction nozzles used in the optoelectronics industry (Ø8 × 3.3 mm) were prepared to examine tip dimensions and deformation. Because the soft rubber and limited grinding allowance made positioning difficult, the samples were cold-mounted in high-flow epoxy resin. Floating was carefully prevented, with thin double-sided tape used when necessary to maintain stable positioning.

An ABF package substrate was prepared for cross-sectional observation of its solder joints. Because the fine circuit layers and small solder balls require accurate positioning, the sample was cold-mounted in transparent epoxy to secure its orientation and protect the edges. Controlled grinding was performed gradually until the centers of the target solder joints were exposed, followed by fine polishing to minimize scratches, edge rounding, and smearing. The finished cross section enables clear observation of solder ball geometry, joint interfaces, voids, cracks, layer alignment, and surrounding build-up structures.

All samples are used solely for testing and technical validation. They are carefully labeled, stored, and returned in accordance with our internal procedures, ensuring complete protection of customer material data, process details, and R&D results, so customers can confidently entrust us with critical samples.