Precision Cutting

Introduction

TOPTECH Precision Diamond Saws are engineered for high-hardness and brittle materials, delivering exceptional results with low noise and vibration. Designed specifically for semiconductor, electronic components, and research industries, these machines ensure minimal thermal and physical damage to delicate samples.

Precision Flatness within 0.05mm - 0.01mm
Movement Micro-adjustment display up to 0.001mm
Rotation Speed Adjustable up to 5000 RPM
Efficiency Automatic stop protection & Diamond blade dressing
Versatility Rocker arm, handwheel, or platform cutting modes

Suitable Materials:
Diamond, Silicon Wafers, Sapphire, Tungsten Carbide, Ceramics, and Precision Electronic Parts.

For more details, please refer to our Selection Guide or Contact Us to schedule a sample test!

Auto. Abrasive Cutter CK260B/360B/460B
Auto. Abrasive Cutter CK260B/360B/460B
Auto./ Manual Abrasive Cutter CF250B
Auto./ Manual Abrasive Cutter CF250B
Abrasive Cutter- Simple Type CL50F-E
Abrasive Cutter- Simple Type CL50F-E
Abrasive Cutter- Simple Type CL50R-E
Abrasive Cutter- Simple Type CL50R-E
Auto./ Manual Abrasive Cutter CF450S
Auto./ Manual Abrasive Cutter CF450S
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